Application Advantages
- High-precision 3D imaging technology, small-angle 4-way projection system, further eliminates small spacing occlusion;
- 12 million pixel high-resolution industrial camera, optional 21 million pixels, high-speed CoaXPress transmission method, the detection speed has increased by 40% compared with the traditional Camera Link;
- Standard Z-axis module, can perform large-scale bending board compensation;
- Multi-angle light source combined with high-resolution camera and telecentric lens greatly improves detection effect;
- Offline programming and debugging without occupying equipment inspection time.
Specifications
| Visual System | Imaging | 12MP industrial camera （21MP optional） |
| Resolution | 5μm/10μm/15μm | |
| Detection Speed | 6.7c㎡/s 26.7c㎡/s 60c㎡/s | |
| Lighting | RGBW LED | |
| Hardware | Power Supply | 200V-230V AC 50/60Hz |
| Power | 2.2KW | |
| Air Pressure | 0.4-0.6MPa | |
| Weight | 1300KG | |
| Equipment Dimensions | 1100mm（L）*1350mm（W）*1630mm（H） | |
| Inspection Specifications | Substrate Sizes | 510*460mm |
| Substrate Thickness | 0.4-6mm | |
| PCB Edge Clearance | 3mm | |
| Top and Bottom Board Clearance | 45mm | |
| Transport Height | 900±50mm | |
| Measurement Height | Maxium measurement height up to 30mm | |
| Optional Features | Artifical Intelligent Inspection | Detectable defect types: Pre-oven tin balls, gold surface scratches, gold surface contamination, tin adhesion, tin balls, foreign objects |
| Auxiliary Functions | Remote centralized review, barcode reading, OCR recognition | |
| Inspection Items | Defects Inspection | Missing components, offset, overturn, float height, billboard, tombstoning, bad solder joints, solder balls, oxidation contamination, foreign objects, scratches, etc. |