Application Advantages
- High-precision 3D imaging technology, small angle dual-projection system, further eliminating small spacing occlusion;
- 12 million pixel high-resolution industrial camera, optional 21 million pixels, high-definition imaging picture quality, while achieving high-speed inspection;
- High-precision automatic Z-axis module, which can adapt to various complex processes;
- It can dock and integrate MES system according to factory requirements;
- Powerful SPC software, providing rich and accurate data statistics.
Specification
| Visual System | Imaging | 12MP industrial camera （21MP optional） |
| Resolution | 5μm/10μm/15μm | |
| Detection Speed | 8.6c㎡/s 34.3c㎡/s 77.1c㎡/s | |
| Lighting | RGBW LED | |
| Hardware | Power Supply | 200V-230V AC 50/60Hz |
| Power | 2.2KW | |
| Air Pressure | 0.4-0.6MPa | |
| Weight | 1300KG | |
| Equipment Dimensions | 1100mm（L）1350mm（W）1630mm（H） | |
| Inspection Specifications | PCB Sizes | 510*460mm |
| PCB Thickness | 0.4-6mm | |
| PCB Edge Clearance | 3mm | |
| Top and Bottom Board Clearance | 45mm | |
| Transport Height | 900±50mm | |
| Measurement Height | Maxium measurement height up to 30mm | |
| Inspection Items | Defects Inspection | Excess solder, insufficient solder, missed print, bridging, missing copper, offset, etc. |
| Data Statistical Analysis | Statistical Graphs and Reports | Histogram, X bar R/S Chart, Cp/Cpk Display, Reproducibility and Repeatability, Daily/Weekly/Monthly/Annual Yield Rate |
| Optional Features | Auxiliary Functions | Remote Centralized Review, Barcode Reading |